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2015 Volume 25 >

Please use this identifier to cite or link to this item: http://hdl.handle.net/10525/3538

Title: Monitoring of Adhesive Joint Used in Lightweight Devices
Authors: Petrova, T.
Kirilova, E.
Becker, W.
Ivanova, J.
Keywords: smart structure
shear lag model
interface delamination
static and electric load
environmental conditions
Issue Date: 2015
Publisher: Institute of Mathematics and Informatics at the Bulgarian Academy of Sciences
Citation: Pliska Studia Mathematica Bulgarica, Vol. 25, No 1, (2015), 119p-128p
Abstract: The excellent performance of the shear lag method for modeling smart pre-damaged bi-material structures under static and dynamic loading lies on the obtained important analytical formulae. The authors developed this method and applied it to investigate the piezoelectric response of a smart structure consisting in a piezoelectric patch over a host layer under static load and affected by electrical load at environment conditions. The interface delamination is investigated and the analytically calculated debond length is found, which is not considered in the typical local techniques. The numerical examples are oriented to the real materials used in the solar cells and other devices. The results are presented in figures and discussed in detail. 2010 Mathematics Subject Classification: 74B15, 34A33.
Description: [Petrova T.; Петрова Т.]; [Kirilova E.; Кирилова Е.]; [Ivanova J.; Иванова Ж.]
URI: http://hdl.handle.net/10525/3538
ISSN: 0204-9805
Appears in Collections:2015 Volume 25

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